Valentina Repetto

Appassionata di tecnologia ma con un amore incondizionato verso la natura, si dedica alla fotografia e al video editing. Curiosa e esploratrice verso tutto ciò che la circonda. Laureata in Scienze e Tecnologie Multimediali, indirizzo comunicazione.

Articoli dell'autore



<img width="768" height="475" src="https://www.innovationpost.it/wp-content/uploads/2016/12/innovation_1000-768x475.jpg" class="card-responsive-img fit-img" alt="IBM inaugura a Rieti un Innovation Center per l&#039;innovazione e la competitività delle imprese" decoding="async" srcset="https://www.innovationpost.it/wp-content/uploads/2016/12/innovation_1000-768x475.jpg 768w, https://www.innovationpost.it/wp-content/uploads/2016/12/innovation_1000-300x186.jpg 300w, https://www.innovationpost.it/wp-content/uploads/2016/12/innovation_1000-600x371.jpg 600w, https://www.innovationpost.it/wp-content/uploads/2016/12/innovation_1000.jpg 1000w" sizes="(max-width: 768px) 100vw, 768px" data-eio="l" />
IBM inaugura a Rieti un Innovation Center per l'innovazione e la competitività delle imprese
26 Nov 2019
di Valentina Repetto
Condividi il post
Condividi



<img width="768" height="432" src="https://img.innovationpost.it/wp-content/uploads/2024/02/22104830/innovationpost-768x432.png" class="card-responsive-img fit-img" alt="Qualcomm e Siemens sviluppano il primo network 5G privato standalone" decoding="async" srcset="https://img.innovationpost.it/wp-content/uploads/2024/02/22104830/innovationpost-768x432.png 768w, https://img.innovationpost.it/wp-content/uploads/2024/02/22104830/innovationpost-1280x720.png 1280w, https://img.innovationpost.it/wp-content/uploads/2024/02/22104830/innovationpost-156x88.png 156w, https://img.innovationpost.it/wp-content/uploads/2024/02/22104830/innovationpost-1536x864.png 1536w, https://img.innovationpost.it/wp-content/uploads/2024/02/22104830/innovationpost-640x360.png 640w, https://img.innovationpost.it/wp-content/uploads/2024/02/22104830/innovationpost-1024x576.png 1024w, https://img.innovationpost.it/wp-content/uploads/2024/02/22104830/innovationpost-lq.png 30w, https://img.innovationpost.it/wp-content/uploads/2024/02/22104830/innovationpost.png 1920w" sizes="(max-width: 768px) 100vw, 768px" data-eio="l" />
Qualcomm e Siemens sviluppano il primo network 5G privato standalone
26 Nov 2019
di Valentina Repetto
Condividi il post
Condividi



<img width="768" height="479" src="https://www.innovationpost.it/wp-content/uploads/2019/11/abb-kit-scuola-768x479.jpg" class="card-responsive-img fit-img" alt="BM Group Polytec dona all&#039;ITT Marconi il Kit School Abb destinato al laboratorio di robotica" decoding="async" srcset="https://www.innovationpost.it/wp-content/uploads/2019/11/abb-kit-scuola-768x479.jpg 768w, https://www.innovationpost.it/wp-content/uploads/2019/11/abb-kit-scuola-300x187.jpg 300w, https://www.innovationpost.it/wp-content/uploads/2019/11/abb-kit-scuola-1024x639.jpg 1024w, https://www.innovationpost.it/wp-content/uploads/2019/11/abb-kit-scuola-1536x958.jpg 1536w, https://www.innovationpost.it/wp-content/uploads/2019/11/abb-kit-scuola-scaled.jpg 2048w, https://www.innovationpost.it/wp-content/uploads/2019/11/abb-kit-scuola-1320x824.jpg 1320w" sizes="(max-width: 768px) 100vw, 768px" data-eio="l" />
BM Group Polytec dona all'ITT Marconi il Kit School Abb destinato al laboratorio di robotica
26 Nov 2019
di Valentina Repetto
Condividi il post
Condividi



<img width="768" height="460" src="https://www.innovationpost.it/wp-content/uploads/2019/11/Simufact-GR-simulated-hinge-vs-additively-maufactured-hinge--768x460.jpg" class="card-responsive-img fit-img" alt="Simufact Additive per l&#039;ottimizzazione dei processi di stampa 3D" decoding="async" srcset="https://www.innovationpost.it/wp-content/uploads/2019/11/Simufact-GR-simulated-hinge-vs-additively-maufactured-hinge--768x460.jpg 768w, https://www.innovationpost.it/wp-content/uploads/2019/11/Simufact-GR-simulated-hinge-vs-additively-maufactured-hinge--300x180.jpg 300w, https://www.innovationpost.it/wp-content/uploads/2019/11/Simufact-GR-simulated-hinge-vs-additively-maufactured-hinge--1024x614.jpg 1024w, https://www.innovationpost.it/wp-content/uploads/2019/11/Simufact-GR-simulated-hinge-vs-additively-maufactured-hinge-.jpg 1200w" sizes="(max-width: 768px) 100vw, 768px" data-eio="l" />
Simufact Additive per l'ottimizzazione dei processi di stampa 3D
26 Nov 2019
di Valentina Repetto
Condividi il post
Condividi



<img width="768" height="637" src="https://www.innovationpost.it/wp-content/uploads/2019/11/ARP089_Siemens_MindSphere-Visual_Smart-city_HRES-768x637.jpg" class="card-responsive-img fit-img" alt="ARP089_Siemens_MindSphere-Visual_Smart-city_HRES" decoding="async" srcset="https://www.innovationpost.it/wp-content/uploads/2019/11/ARP089_Siemens_MindSphere-Visual_Smart-city_HRES-768x637.jpg 768w, https://www.innovationpost.it/wp-content/uploads/2019/11/ARP089_Siemens_MindSphere-Visual_Smart-city_HRES-300x249.jpg 300w, https://www.innovationpost.it/wp-content/uploads/2019/11/ARP089_Siemens_MindSphere-Visual_Smart-city_HRES.jpg 800w" sizes="(max-width: 768px) 100vw, 768px" data-eio="l" />
Arrow Electronics distribuirà i prodotti Siemens MindSphere nella regione EMEA
26 Nov 2019
di Valentina Repetto
Condividi il post
Condividi



<img width="768" height="512" src="https://www.innovationpost.it/wp-content/uploads/2019/11/Premio_ABB_GB_Ferrari_2019_-_002-768x512.jpg" class="card-responsive-img fit-img" alt="Digitalizzazione e Smart cities, ABB premia i giovani talenti" decoding="async" srcset="https://www.innovationpost.it/wp-content/uploads/2019/11/Premio_ABB_GB_Ferrari_2019_-_002-768x512.jpg 768w, https://www.innovationpost.it/wp-content/uploads/2019/11/Premio_ABB_GB_Ferrari_2019_-_002-300x200.jpg 300w, https://www.innovationpost.it/wp-content/uploads/2019/11/Premio_ABB_GB_Ferrari_2019_-_002-1024x683.jpg 1024w, https://www.innovationpost.it/wp-content/uploads/2019/11/Premio_ABB_GB_Ferrari_2019_-_002.jpg 1200w" sizes="(max-width: 768px) 100vw, 768px" data-eio="l" />
Digitalizzazione e Smart cities, ABB premia i giovani talenti
26 Nov 2019
di Valentina Repetto
Condividi il post
Condividi



<img width="768" height="384" src="https://www.innovationpost.it/wp-content/uploads/2019/11/new-768x384.jpg" class="card-responsive-img fit-img" alt="Connettività, le novità Hilscher alla SPS di Norimberga" decoding="async" srcset="https://www.innovationpost.it/wp-content/uploads/2019/11/new-768x384.jpg 768w, https://www.innovationpost.it/wp-content/uploads/2019/11/new-300x150.jpg 300w, https://www.innovationpost.it/wp-content/uploads/2019/11/new.jpg 1000w" sizes="(max-width: 768px) 100vw, 768px" data-eio="l" />
Connettività, le novità Hilscher alla SPS di Norimberga
25 Nov 2019
di Valentina Repetto
Condividi il post
Condividi



<img width="768" height="432" src="https://www.innovationpost.it/wp-content/uploads/2019/11/capture2-768x432.jpg" class="card-responsive-img fit-img" alt="Qualcomm Technologies e Bosch Rexroth presentano il futuro del 5G nell&#039;industria manifatturiera a SPS" decoding="async" srcset="https://www.innovationpost.it/wp-content/uploads/2019/11/capture2-768x432.jpg 768w, https://www.innovationpost.it/wp-content/uploads/2019/11/capture2-300x169.jpg 300w, https://www.innovationpost.it/wp-content/uploads/2019/11/capture2.jpg 993w" sizes="(max-width: 768px) 100vw, 768px" data-eio="l" />
Qualcomm Technologies e Bosch Rexroth presentano il futuro del 5G nell'industria manifatturiera a SPS
25 Nov 2019
di Valentina Repetto
Condividi il post
Condividi



<img width="768" height="513" src="https://www.innovationpost.it/wp-content/uploads/2019/11/340f9b20-947b-457a-9799-c4552b4d3a3d-768x513.jpg" class="card-responsive-img fit-img" alt="Rockwell Automation si allea con Accenture, Microsoft, Ptc, Ansys ed Eplan" decoding="async" srcset="https://www.innovationpost.it/wp-content/uploads/2019/11/340f9b20-947b-457a-9799-c4552b4d3a3d-768x513.jpg 768w, https://www.innovationpost.it/wp-content/uploads/2019/11/340f9b20-947b-457a-9799-c4552b4d3a3d-300x200.jpg 300w, https://www.innovationpost.it/wp-content/uploads/2019/11/340f9b20-947b-457a-9799-c4552b4d3a3d.jpg 800w" sizes="(max-width: 768px) 100vw, 768px" data-eio="l" />
Rockwell Automation si allea con Accenture, Microsoft, Ptc, Ansys ed Eplan
22 Nov 2019
di Valentina Repetto
Condividi il post
Condividi



<img width="768" height="563" src="https://www.innovationpost.it/wp-content/uploads/2019/11/Moog-High-Torque-Motors-1000-630-sizes-768x563.jpg" class="card-responsive-img fit-img" alt="Le novità Moog in fiera alla SPS di Norimberga" decoding="async" srcset="https://www.innovationpost.it/wp-content/uploads/2019/11/Moog-High-Torque-Motors-1000-630-sizes-768x563.jpg 768w, https://www.innovationpost.it/wp-content/uploads/2019/11/Moog-High-Torque-Motors-1000-630-sizes-300x220.jpg 300w, https://www.innovationpost.it/wp-content/uploads/2019/11/Moog-High-Torque-Motors-1000-630-sizes.jpg 1000w" sizes="(max-width: 768px) 100vw, 768px" data-eio="l" />
Le novità Moog in fiera alla SPS di Norimberga
22 Nov 2019
di Valentina Repetto
Condividi il post
Condividi



<img width="768" height="483" src="https://www.innovationpost.it/wp-content/uploads/2019/11/3Dprinted_Plug_FDR_EOS-768x483.jpg" class="card-responsive-img fit-img" alt="Stampa 3D con laser CO per componenti con superfici sottili ma robuste" decoding="async" srcset="https://www.innovationpost.it/wp-content/uploads/2019/11/3Dprinted_Plug_FDR_EOS-768x483.jpg 768w, https://www.innovationpost.it/wp-content/uploads/2019/11/3Dprinted_Plug_FDR_EOS-300x189.jpg 300w, https://www.innovationpost.it/wp-content/uploads/2019/11/3Dprinted_Plug_FDR_EOS-1024x644.jpg 1024w, https://www.innovationpost.it/wp-content/uploads/2019/11/3Dprinted_Plug_FDR_EOS-1536x966.jpg 1536w, https://www.innovationpost.it/wp-content/uploads/2019/11/3Dprinted_Plug_FDR_EOS-scaled.jpg 2048w, https://www.innovationpost.it/wp-content/uploads/2019/11/3Dprinted_Plug_FDR_EOS-1320x830.jpg 1320w" sizes="(max-width: 768px) 100vw, 768px" data-eio="l" />
Stampa 3D con laser CO per componenti con superfici sottili ma robuste
21 Nov 2019
di Valentina Repetto
Condividi il post
Condividi